Forms related to Textbook Companion Internship
You may download the following forms related to Textbook Companion Internship. These forms are to be filled and should be sent to the address given at the bottom of this page.
Please send ALL the forms in a SINGLE envelope. 'Forms' not sent together shall not be considered under any circumstances.
The mailing address for these forms is
Prof. Shivasubramanian Gopalakrishnan,
Dept. of Mechanical Engineering,
IIT Bombay, Powai, Mumbai 400 076
Please write "OpenFOAM Textbook Companion" on top of the envelope.
For the queries related to submission of forms please contact contact-cfd(at)fossee(dot)in.